The growing imbalance between the amount of data that needs to be processed to train large language models (LLMs) and the ...

The convergence of front-end and back-end processes in advanced packaging is reshaping the industry. The semiconductor ...

To achieve ExaFLOPS computing power, it requires at least 1,000 AI chiplets interconnected by advanced high-density RDL ...

Demand for AI chips is growing exponentially, but costs and complexity limit the technology to a handful of companies. That ...

Using lower temperature and no flash point chemicals to achieve comparable deflashing effectiveness without inducing ...

Integrating the next generation of RF, electronic, and photonic components into networking, telecom, and radar systems.

Using 3D process models to predict the impact of mechanical stress on yield and performance. With the semiconductor industry ...

From Stacked Nano-Sheet to Fork-Sheet and CFET Devices” was published by researchers at Imec and Ghent University, et al.

A technical paper titled “Buried power rail to suppress substrate leakage in complementary field effect transistor (CFET)” ...

The 10 angstrom node will usher in new architectures, tooling, and materials, forcing a massive change in the way fabs build interconnects.

A new lithography library brings mask optimization operations to GPUs. There are so many challenges in producing modern semiconductor devices that it’s amazing for the industry to pull it off at all.

A new technical paper titled “Facilitating Small-Pitch Interconnects with Low-Temperature Solid-Liquid Interdiffusion Bonding ...